Shengli Technologies
Circuit mix
Where Shengli Technologies shows up, by circuit. Each event counts once: 2 if it sponsored, 1 if it only had speakers. Hover a segment for the conference.
- Software engineering & trading tech100%13 events
Presence by conference and year
Each cell is one conference in one year. Fill shows the company sponsored, shaded by its best tier that year; a dot means it had speakers there. Hover for details; click to open the event.
- Title
- Platinum
- Gold
- Silver
- Bronze
- Other / unlabeled tier
- Had speakers
| Conference | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 | 2027 | 2028 |
|---|---|---|---|---|---|---|---|---|---|---|
| STAC Summit |
Activity by year
Three measures on one year axis; each panel has its own scale. 2027, 2028 is still mostly ahead, so its bars are faded and incomplete.
Conferences present at
Distinct conferences each year, split by whether the company sponsored or only had speakers there.
- Sponsored
- Speakers only
Distinct speakers
People from this company on a program that year, each counted once.
Sponsorships by tier
Sponsorship rows per year (one per event and listing), stacked by normalized tier.
- Gold
- Silver
- Bronze
- Other / unlabeled
Where they've grown or pulled back
FlatSponsored 1 conference in 2026, flat from 1 in 2023.
Counted per conference. 2026 is the latest year whose conferences have mostly happened. Tiers use the best tier each year; swatches show the path, oldest first. A conference counts as pulled out only when a later event published a complete sponsor list, since most events don’t say whether their list is complete.
Moved down 1
Best tier fell between the first and latest year with a ranked tier.
- STAC SummitGold 2023 → Silver 2026
Not on the company map: lookalikes are computed only for companies present at four or more conferences.
Often sponsors alongside
Companies that sponsored the same events, by number of shared events (out of 13 this company sponsored).
| Company | Shared events | Share |
|---|---|---|
| DDN | 10 | 77% |
| AMD | 9 | 69% |
| Arista | 9 | 69% |
| Silicon Creations | 8 | 62% |
| KX | 7 | 54% |
| Orthogone Technologies | 7 | 54% |
| Supermicro | 7 | 54% |
| Cadence | 6 | 46% |
| Keysight | 6 | 46% |
| Aeron (Adaptive) | 5 | 38% |
| Dell Technologies | 5 | 38% |
| ICC (Intelligent Computing Concepts) | 5 | 38% |
| Intel | 5 | 38% |
| Lenovo | 5 | 38% |
| Liquid Technology | 5 | 38% |
Sponsorships 13
| Event | Date | Place | Tier as listed | Normalized tier |
|---|---|---|---|---|
| STAC Summit New York, Fall 2026 | Oct 21, 2026 | New York, United States | Silver | Silver |
| STAC Summit Tokyo, Fall 2026 | Sep 15, 2026 | Tokyo, Japan | Silver | Silver |
| STAC Summit Sydney, Fall 2026 | Sep 10, 2026 | Sydney, Australia | Silver | Silver |
| STAC Summit Tokyo, Fall 2025 | Sep 18, 2025 | Tokyo, Japan | BRONZE SPONSORS | Bronze |
| STAC Summit Singapore, Spring 2025 | Apr 8, 2025 | Singapore, Singapore | ADDITIONAL EXHIBITORS | Other |
| STAC Summit Asia (Singapore), Spring 2024 | Jun 27, 2024 | Singapore, Singapore | Exhibitor | Other |
| STAC Summit Chicago, Spring 2024 | May 30, 2024 | Chicago, United States | GOLD SPONSORS | Gold |
| STAC Summit New York, Spring 2024 | May 14, 2024 | New York, United States | GOLD SPONSORS | Gold |
| STAC Summit London, Spring 2024 | May 2, 2024 | London, United Kingdom | GOLD SPONSORS | Gold |
| STAC Summit Chicago, Fall 2023 | Oct 31, 2023 | Chicago, United States | Exhibitor | Other |
| STAC Summit New York, Fall 2023 | Oct 19, 2023 | New York, United States | Exhibitor | Other |
| STAC Summit New York, Spring 2023 | May 31, 2023 | New York, United States | Exhibitor | Other |
| STAC Summit Asia (Singapore), Spring 2023 | Apr 4, 2023 | Singapore, Singapore | GOLD SPONSORS | Gold |
Speakers 15
| Speaker | Event | Role | Talk | Links |
|---|---|---|---|---|
| Louis Liu | STAC Summit New York, Fall 2026 | speaker | Breaking the latency barrier: Shengli’s latest 1+FPGA switches & China’s seismic trading landscape shifts | — |
| Louis Liu | STAC Summit Tokyo, Fall 2026 | speaker | Breaking the latency barrier: Shengli’s latest 1+FPGA switches & China’s seismic trading landscape shifts | — |
| Louis Liu | STAC Summit Sydney, Fall 2026 | speaker | Breaking the Latency Barrier: Shengli’s Latest 1+FPGA Switches & China’s Seismic Trading Landscape Shifts | — |
| Louis Liu | STAC Summit Tokyo, Fall 2025 | speaker | Latest Cool Products from Shengli Hardware Lab / Shengli Hardware Labの最新のクールな製品 | — |
| Louis Liu | STAC Summit Singapore, Spring 2025 | panelist | Cool running: managing trading colos and data centers to meet today’s demands | — |
| Louis Liu | STAC Summit Asia (Singapore), Spring 2024 | speaker | The Express Lane to China’s Financial Markets - Shengli’s market leading trading solution suite based on FPGA and purpose-built hardware | — |
| Louis Liu | STAC Summit Asia (Singapore), Spring 2024 | speaker | Threading the needle: Navigating constraints to compete in real time | — |
| Patrick Egan | STAC Summit Chicago, Spring 2024 | speaker | Threading the needle: Navigating constraints to compete in real time | — |
| Patrick Egan | STAC Summit Chicago, Spring 2024 | speaker | Latest Cool Products from Shengli Hardware Lab | — |
| Louis Liu | STAC Summit New York, Spring 2024 | speaker | Threading the needle: Navigating constraints to compete in real time | — |
| Louis Liu | STAC Summit New York, Spring 2024 | speaker | Latest Cool Products from Shengli Hardware Lab | — |
| Louis Liu | STAC Summit London, Spring 2024 | speaker | Latest Cool Products from Shengli Hardware Lab | — |
| Louis Liu | STAC Summit London, Spring 2024 | speaker | Threading the needle: Navigating constraints to compete in real time | — |
| Louis Liu | STAC Summit Asia (Singapore), Spring 2023 | speaker | Build for today, plan for tomorrow: Low-latency market integration | — |
| Louis Liu | STAC Summit Asia (Singapore), Spring 2023 | speaker | Lessons From Developing FPGA Based Advanced Trading Solutions for China's Capital Markets | — |